Winbond Electronics Corp. cut NT$6.6 billion (US$208 million) from its equipment orders as the memory chipmaker’s 16-nanometer technology development outpaced initial projections.
The Taiwanese manufacturer reduced its 2022 equipment purchase commitments to NT$9.41 billion from NT$16.01 billion, according to a company filing. The original orders were placed with key semiconductor equipment suppliers including Applied Materials Inc., Lam Research Corp., and Tokyo Electron Ltd.
The company reported 2024 net income of NT$601 million, down from the previous year, with earnings per share of NT$0.14. Revenue fell to NT$81.61 billion. The board decided against paying dividends to shareholders.
For 2025, Winbond approved a capital expenditure budget of NT$529 million, covering production equipment, research and development tools, and real estate investments.
The revision of equipment orders reflects better-than-anticipated production yields for its 16nm process technology, which the company achieved in a shorter timeframe than the initial three-year projection. The memory maker said the adjustment aligns with current market demands and won’t significantly impact its operations.
Winbond plans to provide more details about its second-half 2024 outlook at an investor conference scheduled for February 19. The company’s annual shareholder meeting will be held on May 27 in Hsinchu.
