Taiwan Semiconductor Manufacturing Co. (TSMC) introduced its latest innovation, the 3Dblox standard, at the TSMC Open Innovation Platform (OIP) Ecosystem Forum in the United States. The new standard is designed to accelerate breakthroughs in the 3D IC ecosystem and enhance the versatility of EDA tools in semiconductor design.
Dan Kochpatcharin, head of TSMC’s Design Construction Management Department, highlighted the importance of partnerships with OIP collaborators to address the physical challenges of 3D IC architecture. Leveraging TSMC’s cutting-edge 3DFabric technology, the initiative seeks to improve AI chip design performance in areas like power consumption, efficiency, and quality of design results.
TSMC’s focus on 3D IC design comes as the demand for high-performance AI chips continues to rise, particularly in data centers. As a leader in the 3Dblox standard development, TSMC plans to make the framework accessible to partners through IEEE, aiming to spur further innovation across the industry.
The forum also recognized several partners, including Liwang and M31, for their advancements in semiconductor technology. Broadcom, a key player in AI chip development, recently launched the first 3D SoIC device built on TSMC’s 5nm process, a pivotal step toward future mass production.
