Taiwan’s GlobalWafers secured NT$6.45 billion ($200 million) from the U.S. CHIPS Act in June, representing roughly half of its approved government subsidy package, according to parent company Sino-American Silicon Products.
The funding represents about half of a $406 million award announced last December by the former Biden administration for the company’s projects in Texas and Missouri to significantly expand U.S. silicon wafer production. The silicon wafer manufacturer received the disbursement despite ongoing uncertainty over the program’s future under the Trump administration.
President Donald Trump’s administration had cast some doubt over whether the awards would go forward, saying that they were renegotiating some CHIPS Act grants. U.S. Commerce Secretary Howard Lutnick said in June that they may axe some of the awards.
The timing proves fortuitous for GlobalWafers, which opened its NT$112.9 billion ($3.5 billion) wafer plant in Sherman, Texas, in May. GlobalWafers said in May the overall grant was to be disbursed in stages upon reaching specific milestones.
The CHIPS Program Office has told recipients that certain conditions that do not align with President Trump’s executive orders and policies are now under review for all CHIPS Direct Funding Agreements. The company awaits clarity on whether remaining subsidies face modifications or cancellation as the new administration scrutinizes Biden-era semiconductor investments.
GlobalWafers’ early collection demonstrates the value of swift milestone completion before policy shifts take effect.
