SK Hynix Inc., the global leader in high-bandwidth memory production, intends to secure orders for its entire 2026 HBM output within the first half of this year, according to CEO Kwak Noh-jung.
Speaking at the company’s annual shareholder meeting Thursday, Kwak said the South Korean chipmaker is moving to enhance revenue visibility by finalizing supply agreements well in advance. The company has already sold out its planned 2025 HBM production.
“Given the high investment costs and long production periods for HBM products, we are increasing sales visibility through advance volume agreements with customers,” Kwak told shareholders.
SK Hynix recently delivered samples of its next-generation 12-layer HBM4 memory to key customers ahead of schedule, aiming to become the first company to mass-produce the sixth-generation HBM in the second half of 2025.
The memory manufacturer dismissed concerns about potential weakened demand from low-cost Chinese AI models, with Kwak projecting the HBM market to expand more than 8.8 times this year compared to 2023 levels.
SK Hynix is also developing SOCAMM, a memory module optimized for data center servers, with plans for mass production this year.
The company reported record operating profit of 23.47 trillion won ($17.3 billion) on revenue of 66.19 trillion won ($48.9 billion) in 2024, with HBM accounting for approximately half of sales.
