Experts predict a seismic shift in the cloud industry as Silicon Photonics (SiPh) emerges as a transformative force, boasting communication speeds exceeding 1.6 Tbps. The integration of Co-Packaged Optics (CPO) addresses power consumption challenges by combining optical components and Application-Specific Integrated Circuit (ASIC) technology into a unified module.
SiPh’s versatility extends across communication transmission, biomedical sensing, LiDAR, high-speed AI, smart healthcare, and autonomous vehicles, signifying its immense potential. TSMC, ASE, SunSin, and Accton, prominent players in semiconductors, express optimism about SiPh and CPO technologies.
Despite enthusiasm, obstacles like chip yields and standardization persist, with resolutions expected post-2025. In the photonic integration realm, TSMC leads among Taiwanese manufacturers with COUPE, a technology yielding a 40% reduction in energy consumption.
TSMC’s investment in a 200-person R&D team, collaborating internationally, signifies commitment. ASE, leveraging the VIPack platform, foresees an uptick in SiPh and CPO business in late 2024, with significant momentum in 2025. Networking company Accton focuses on photonic integration for switches, while SunSin strategically positions itself in CPO process technology, reflecting the growing influence of SiPh on industry leaders.
