Resonac Corporation has assembled a 27-member global consortium to accelerate development of advanced semiconductor packaging technologies, positioning itself to capitalize on the artificial intelligence chip boom that has strained industry capacity.
The Japanese materials maker, Nikkei reported, will lead the initiative alongside major equipment manufacturers including Applied Materials and Tokyo Electron. The consortium aims to develop panel-level organic interposers—components that connect different elements within chip packages—using square organic material panels rather than traditional circular wafers.
The timing reflects mounting pressure across the semiconductor supply chain. Advanced packaging has emerged as a critical bottleneck, with companies scrambling to meet demand from AI applications that require sophisticated multi-chip modules. Industry analysts project the advanced packaging market will experience significant growth through 2025, driven primarily by data center expansion and AI accelerator requirements.
Resonac plans to establish an Advanced Panel Level Interposer Center at its Shimodate Plant in Japan’s Ibaraki Prefecture, with prototype production scheduled to commence in 2026. The facility represents the company’s latest expansion following previous consortium efforts, including US-JOINT launched in Silicon Valley last year.
The initiative builds on Resonac’s existing JOINT and JOINT2 programs, suggesting a methodical approach to capturing market share in what has become a highly competitive segment of semiconductor manufacturing.
