Powerchip Semiconductor Manufacturing Corp. is joining forces with ten Taiwanese tech companies to showcase comprehensive 3D AI semiconductor solutions at the upcoming Computex exhibition in Taipei.
The Taiwan-based chipmaker, along with partners including ASPEED, Industrial Technology Research Institute, Skymizer and Powerchip Technology, will demonstrate technologies spanning from intellectual property and IC design services to high-bandwidth memory architectures and 3D packaging solutions.
Chairman Frank Huang cited strong market validation for the company’s existing offerings, noting that its Wafer-on-Wafer products have already been adopted by international customers and leading logic foundries. The company’s Interposer technology is facing supply constraints due to robust demand from AI applications.
“The supply shortage of our successfully mass-produced Interposer reflects the intense demand in the AI market,” Huang said.
The partnership specifically targets two high-growth AI segments: language model inference and image recognition applications.
Taiwan’s semiconductor ecosystem has been rapidly expanding its presence in AI chip solutions as global technology companies compete to develop more efficient and cost-effective hardware for artificial intelligence applications. The collaboration aims to help system designers develop high-performance, energy-efficient AI solutions at competitive price points.
