Powerchip Semiconductor Manufacturing Corp. is repositioning its Tongluo fab to focus on artificial intelligence chip production, targeting high-margin 3D wafer stacking and interposer manufacturing services.
The Taiwanese contract chipmaker has begun installing equipment for advanced packaging technologies at the facility, which has a maximum capacity of 40,000 12-inch wafers per month. Chairman Frank Huang said the strategic shift comes as mature process foundries face structural industry changes.
The company’s power management integrated circuits (PMICs) have reached monthly production of 1,000 wafers, with growth expected next year as AI server demand rises. The firm has been expanding its non-Chinese supply chain relationships, seeing progress with European and American customers in PMIC and NOR flash development.
Powerchip’s Tongluo facility is now certified for high-capacity interposer production with initial small-volume shipments underway. The plant will coordinate with the company’s Hsinchu operations to achieve monthly production capacity of several thousand interposer wafers, positioning itself to capture growing demand for advanced packaging solutions in AI applications.
