Hanmi Semiconductor Co. is set to distribute its largest-ever dividend payout after the chip equipment maker posted record earnings last year, signaling growing confidence in its business outlook amid surging demand for advanced packaging tools.
The South Korean manufacturer will pay shareholders 68.3 billion won ($51.2 million) in dividends, or 720 won per share, the company said Monday. The payout represents a 69% increase from last year’s 40.5 billion won distribution.
The move follows Hanmi’s stellar 2023 performance, with revenue reaching 558.9 billion won and operating profit hitting 255.4 billion won. The company’s success stems from its vertically integrated production of critical semiconductor packaging equipment, including thermal compression bonders essential for high-bandwidth memory manufacturing.
Operating from an 89,530-square-meter facility in Incheon’s Juan Industrial Complex, Hanmi has built a client base of more than 320 customers worldwide. The company’s manufacturing capabilities now support annual production capacity worth 2 trillion won.
Shareholders must hold the stock through March 7 to qualify for the dividend payment, following revised regulations implemented last year.
