South Korean equipment maker Hanmi Semiconductor launched specialized machinery for producing HBM4 memory chips, positioning itself for the next wave of artificial intelligence hardware demand. The company unveiled its TC Bonder 4 system in May, designed specifically for the upcoming sixth-generation high-bandwidth memory standard.
Chairman Kwak Dong-shin stated that with the relaxed height standards of HBM4, the new TC Bonder 4, featuring significantly improved production efficiency and precision, will support global customers in mass-producing HBM4 in the second half of this year. However, SK Hynix plans mass production of its 12Hi HBM4 memory for October 2025 while Samsung accelerates HBM4 development for 2025 launch, making Hanmi’s timeline appear optimistic.
The announcement comes as Hanmi faces mounting competitive pressure in the thermal compression bonding market. Recent developments involving key player Hanmi Semiconductor, Micron, and SK hynix have sparked attention, with Hanmi increasing TC bonder prices by 25% starting April 1 and tensions rising with longtime customer SK Hynix.
Hanmi reportedly holds a commanding 90% share in the TC bonder market for HBM3E, but the transition to HBM4 could reshape competitive dynamics as memory manufacturers evaluate new production technologies and supplier relationships.
The equipment maker’s revenue projections for 1.2 trillion won ($870 million) in 2025 depend heavily on securing orders from major memory producers still finalizing their HBM4 strategies.
