Hanmi Semiconductor Co., a leading South Korean chip equipment manufacturer, announced a substantial order from SK Hynix Inc. for its dual TC bonder Griffin equipment, integral to high-bandwidth memory (HBM) production. The contract, valued at 149.9 billion won ($109.5 million), represents a significant portion of Hanmi’s previous year’s consolidated sales, which totaled 159 billion won.
The dual TC bonder Griffin is specialized equipment that utilizes through-silicon via (TSV) technology to attach and stack semiconductor chips onto wafers, a critical process in HBM manufacturing. This advanced technology supports the increasing complexity and performance demands of modern semiconductor applications.
This latest order is part of a series of contracts between Hanmi Semiconductor and SK Hynix, with previous orders totaling over 200 billion won. The cumulative value of orders for the dual TC bonder Griffin from SK Hynix now stands at 358.7 billion won.
The significant contract underscores the strong demand for TSV technology in the semiconductor industry and positions Hanmi Semiconductor as a key supplier for SK Hynix’s advanced memory solutions. This order is expected to bolster Hanmi’s financial performance and highlight its critical role in the global semiconductor supply chain.
