South Korean chip equipment maker Hanmi Semiconductor is building its seventh manufacturing facility in Incheon, strengthening its grip on the high-bandwidth memory (HBM) equipment market.
The 14,400-square-meter plant, scheduled for completion in the fourth quarter of 2024, will produce advanced chip packaging tools including 2.5D Big Die TC bonders and fluxless bonders for sixth-generation HBM production.
Hanmi dominates the thermal compression (TC) bonder market, supplying 90% of HBM3E 12-stage products to major tech firms including SK Hynix, Micron, Nvidia, and Broadcom. TC bonders are crucial in connecting stacked DRAMs through heat and pressure application.
The expansion will increase Hanmi’s total HBM TC bonder production space to 89,530 square meters. The company projects this enhanced capacity will help drive annual sales to 2 trillion won ($1.5 billion).
This expansion comes as demand for HBM solutions grows, particularly from AI chip manufacturers who require advanced memory packaging technology. However, the ambitious sales target may face challenges from market volatility and potential shifts in semiconductor demand.
The move also highlights South Korea’s push to maintain its competitive edge in semiconductor manufacturing equipment as global competition intensifies.
