Gudeng Precision’s March revenue jumped 76.9% from a year earlier to NT$860 million (US$27 million), reaching a monthly record as Chinese customers accelerated orders for semiconductor carriers.
The Taiwanese carrier manufacturer reported first-quarter revenue of NT$1.71 billion, up 21% year-over-year. The company attributed the growth to strong demand from Chinese clients seeking alternatives to American and Japanese competitors amid ongoing US-China trade tensions.
Gudeng is developing carriers for chip-on-wafer-on-substrate (CoWoS) advanced packaging with European and American customers, positioning itself for future growth in this emerging segment. CoWoS packaging technology is increasingly important for artificial intelligence and high-performance computing applications.
“The pattern of relying on a single client for revenue has significantly improved,” the company stated, noting balanced contributions from Taiwan and Greater China while seeing “noticeable growth” in orders from the US, Japan, and Korea.
The diversification strategy comes as semiconductor manufacturers seek stable supply chains. TSMC, a likely customer, is developing next-generation CoWoS technology for 2025 that will enable much larger chip packaging.
Gudeng has faced patent challenges from competitors. In 2023, Entegris filed infringement claims against Gudeng regarding front-opening unified pod (FOUP) technologies.
