Taiwan’s GlobalWafers Co. plans to distribute its lowest semi-annual dividend in four years, reflecting persistent weakness in the semiconductor industry. The company will pay NT$5 ($0.16) per share for the first half of 2023, down from NT$6.5 a year earlier.
The reduced payout comes as the silicon wafer manufacturer grapples with rising costs and declining revenue. Net income fell 34.5% to NT$6.41 billion ($203 million) in the first half, while revenue dropped 16.7% to NT$30.41 billion.
Higher depreciation and electricity expenses squeezed profit margins at the Hsinchu-based company, which supplies wafers to major chipmakers. The dividend announcement signals continuing pressure on the semiconductor supply chain, even as some industry players report early signs of recovery.
The cash dividend, totaling NT$2.39 billion, will be distributed to shareholders on February 14, with the ex-dividend date set for January 10. The company reported earnings per share of NT$14.04 for the first half of the year.
GlobalWafers adopted its semi-annual dividend policy in 2020, making this the smallest payout since that change.
