IC design company Etron Technology has unveiled its Heterogeneous Integration Total Solution through the innovative MemorAiLink platform. This one-stop development platform offers a variety of memory options and complete memory interface IP services, optimizing the overall performance and cost of System on Chips (SoCs) and accelerating product time to market.
Etron Technology, in collaboration with Equn Technology, has developed the EJ525D/EJ523D audio and video capture ICs subsystem using the MemorAiLink platform. These PCIe audio and video capture cards and image capture products are now in mass production, showcasing the efficiency of MemorAiLink’s heterogeneous integration. This platform provides customers with competitive solutions, including innovative memory products, heterogeneous integration packaging, and memory interface IP services, aiding in early-stage design and development.
Lu Chaoqun, chairman of Etron Technology, highlighted that heterogeneous integration and chip subsystem design are key trends in semiconductor development. Etron’s MemorAiLink AI memory platform aligns various technical components with suitable memory and packaging technologies, enabling complex chip designs and reducing product development time. The launch of the EJ525D/EJ523D audio and video capture ICs is particularly significant, given the rising demand for audio and video streaming technology. These ICs, based on MemorAiLink, offer multiple signal switching and integration, enhancing audio and video streaming applications and business models.
In early 2024, Etron introduced the RPC Subsystem Total Solution on the MemorAiLink platform. This solution aids in designing miniaturized, low-power special application ASIC systems, reducing wiring complexity and packaging costs. The RPC Subsystem combines Etron’s RPC DRAM, RPC controller, and 3D depth imaging chip, providing complete AI terminal application solutions. Utilizing x16 DDR3 LPDDR3 data bandwidth and the FI-WLCSP package, this solution minimizes wires and costs compared to traditional DDR3 packaging, further optimizing heterogeneous integrated packaging.
Lu emphasized Etron’s core strengths in memory and logic chip design, citing recent advancements in innovative memory solutions. The MemorAiLink platform, integrating memory and memory controllers with logic chips, offers competitive solutions through heterogeneous integrated packaging and memory interface IP services, positioning Etron as a leader in advanced semiconductor technology.
