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Amkor to Package TSMC Chips for Apple in New Arizona Facility, Aligned with CHIPS and Science Act

Taiwan
t 2330.TW Blue Chip 150 Semicon 75 Tech 350
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Amkor, a prominent semiconductor packaging and test services provider, has unveiled plans to construct an advanced semiconductor packaging and test facility in Peoria, Arizona, USA. The facility, set to span 500,000 square feet of cleanroom space on a 55-acre land, will employ around 2,000 workers and aims to be a “state-of-the-art manufacturing campus.” Amkor anticipates completing the construction within the next two to three years.

The strategic move follows Amkor’s announcement that Apple will be its inaugural and primary customer once the Peoria factory commences operations. The facility will be responsible for packaging and testing chips produced by Taiwan Semiconductor Manufacturing Company (TSMC), a critical supplier for Apple, at a nearby manufacturing site.

Amkor has positioned itself to benefit from the CHIPS and Science Act of 2022, recently introduced by the U.S. government. This legislation allocates $39 billion in competitive grants to U.S. companies, aimed at supporting manufacturers in constructing, expanding, and modernizing facilities and equipment. Amkor has applied for this program, seeking funding to facilitate the construction of its new plant in Peoria, aligning with broader national initiatives to bolster semiconductor manufacturing capabilities in the United States.

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