UMC’s 12nm FinFET technology platform, developed in collaboration with Intel, is progressing on schedule with completion expected by 2026. The Taiwanese foundry reported earnings of NT$3.8 per share (US$0.12) in 2024 as it pivots toward specialty processes amid intensifying competition from Chinese manufacturers.
The chipmaker disclosed significant progress in advanced packaging, successfully developing wafer-level hybrid bonding and 3D IC heterogeneous integration technologies aimed at supporting edge and cloud AI applications. These developments complement UMC’s US$2.9 billion capital expenditure last year, primarily directed toward capacity expansion in Taiwan, Singapore, and China facilities.
UMC’s strategic shift toward specialty processes comes as the global semiconductor landscape grows increasingly competitive. The Intel partnership, announced in January 2024, represents a key component of UMC’s technology roadmap, with mass production targeted for 2027. The collaboration leverages Intel’s U.S.-based manufacturing facilities and FinFET expertise while providing UMC access to a geographically diversified supply chain.
The company’s R&D investments, totaling NT$15.6 billion (US$490 million) in 2024, have yielded additional breakthroughs, including 22nm image signal processor development and advancements in gallium nitride (GaN) device processes. GaN RF switch components have already entered mass production, while GaN RF power amplifier and 650V power device processes are in customer validation and trial production phases.
