Taiwan Semiconductor Manufacturing Co. will establish a chip design center in Munich this year, expanding its European footprint as the world’s largest contract chipmaker seeks closer ties with regional customers.
The facility, set to open in the third quarter, will help European clients develop semiconductors for automotive, industrial, artificial intelligence and internet-of-things applications, according to Paul de Bot, president of TSMC Europe, who disclosed the plans at the company’s technology symposium in Amsterdam on Tuesday.
The Munich center represents another step in TSMC’s methodical European expansion, complementing its €10 billion ($11.3 billion) manufacturing plant under construction in Dresden, Germany. That facility, a joint venture with Infineon Technologies AG, NXP Semiconductors NV and Robert Bosch GmbH, won’t begin production until late 2027.
The design center differs from traditional research facilities by focusing specifically on customer service, helping clients create chip layouts compatible with TSMC’s manufacturing processes. This customer-centric approach reflects growing competition among foundries to secure long-term relationships with European semiconductor buyers.
TSMC’s European strategy mirrors its global diversification efforts, with the Taiwanese company also building facilities in Arizona and Japan to reduce dependence on its home base. The Munich location places TSMC alongside Apple Inc., which operates its largest European engineering hub in the Bavarian capital.
The move underscores Europe’s push for semiconductor self-sufficiency as geopolitical tensions reshape global supply chains.
