TSMC, the global leader in 3nm semiconductor technology, is reportedly seeing a significant increase in New Tape-Outs (NTOs) for its 3nm family of processes in 2024. This surge includes orders from prominent clients such as MediaTek, AMD, NVIDIA, Qualcomm, and Intel. The N3P process, a key member of this 3nm family and set for mass production in the latter half of 2024, is also making substantial progress.
Adding to this momentum, Tesla has been reported as a new customer for TSMC’s N3P process. The electric vehicle giant plans to use this advanced technology for its upcoming Full Self-Driving (FSD) chips, marking a significant shift in its production strategy.
Tesla’s relationship with TSMC for chip production is not new, as they have previously ordered various chips for electric vehicles, including the supercomputer chip “D1” using TSMC’s 7nm technology. Previously, Tesla’s older FSD chips were produced using Samsung’s 14nm and later 7nm processes. However, for its HW 4.0 autonomous driving chip, Tesla transitioned to TSMC’s 5nm technology family, citing factors like design upgrades and production quality.
The latest reports indicate that Tesla is initiating a new NTO process with TSMC, aiming to harness the N3P technology for its fifth-generation self-driving vehicle chips. This move could potentially elevate Tesla to become one of TSMC’s major clients, given the high market expectations and the influx of related orders.
TSMC’s N3P process represents a significant advancement within the 3nm family, scheduled for production in 2024. It promises a 5% increase in performance, a 5% to 10% reduction in power consumption, and a 1.04 times boost in chip density compared to its predecessor, the N3E. This technological leap by TSMC is poised to set new benchmarks in the semiconductor industry, especially for applications in cutting-edge fields like autonomous driving.
