TSMC is set to hold a groundbreaking ceremony for its first European 12-inch fab in Dresden, Germany, marking a significant step in its global expansion strategy. The semiconductor giant is also making strides in Japan and the United States, with total overseas investments expected to reach nearly $100 billion (NT$3.3 trillion).
The Dresden fab will utilize 28/22nm and 16/12nm process technologies, with an initial production capacity of 40,000 wafers per month. Operations are slated to begin before the end of 2027, with an estimated investment of over €10 billion (US$10.8 billion). This development is expected to create substantial opportunities for third-party manufacturers, with companies like Marketech International and Topco Scientific already establishing a presence in Europe.
In Japan, TSMC’s Kumamoto plant is on track for mass production by the end of this year, making it the fastest project among the company’s overseas ventures. With a planned investment exceeding $20 billion, the two factories in Japan will collectively produce over 100,000 wafers per month, utilizing a range of advanced process technologies.
In the U.S., TSMC has allocated more than $65 billion for capital expenditures.
Through these extensive projects, TSMC aims to solidify its leadership in the global semiconductor industry while supporting the growth of its supply chain partners.
