TSMC has postponed its 2026 equipment procurement plans and delivery schedules, signaling caution over potential policy shifts under a possible Trump presidency. The world’s largest contract chipmaker notified domestic and overseas suppliers about the delay, according to industry sources.
While artificial intelligence drives strong demand for TSMC’s advanced packaging technologies like CoWoS, the company is reassessing its expansion timeline. The planned Tainan facility, acquired from Innolux, faces a 2-3 month equipment installation delay despite ongoing construction.
The chipmaker’s advanced packaging strategy includes supporting Apple’s upcoming WMCM (Wafer-level Multi-Chip Module) technology, expected to replace current InFO-PoP solutions in future iPhone models. This transition could impact overall equipment demand.
TSMC is also exploring equipment optimization, converting existing InFO machinery for use across its 3DFabric platform. This approach mirrors its strategy of adapting 5-nanometer equipment for 3-nanometer production.
Industry observers maintain a positive long-term outlook for advanced packaging demand, despite near-term geopolitical uncertainties forcing semiconductor manufacturers to exercise increased caution in expansion plans.
