Taiwan’s TSMC and South Korea’s Samsung, the world’s largest and second-largest semiconductor foundries, have teamed up to develop the high-bandwidth memory (HBM4) chip, according to reports from Korean media. This marks a rare collaboration between the two competitors, driven by the demands of major clients such as NVIDIA and Google.
Samsung’s head of Memory Business Division, Lee Jung-bae, recently hinted at collaborations with various foundries for HBM solutions. The confirmation came on September 5, when a TSMC executive acknowledged the joint effort on a buffer-less HBM4 chip. This advanced design aims to improve power efficiency by 40% and reduce latency by 10% compared to current models.
Samsung, while capable of producing the full range of HBM4 components, seeks to leverage TSMC’s technology to enhance its offering and attract more clients. The HBM4 chip, key to powering next-generation AI and high-performance computing systems, signals a shift in the semiconductor industry, with traditional rivals forming alliances to meet growing demand.
Samsung’s competitor, SK hynix, already partnered with TSMC earlier this year on HBM4, highlighting the intensifying competition to lead in this critical sector. Samsung aims for mass production of its HBM4 chips by late 2025.
