Power Semiconductor Manufacturing Co. is pushing into advanced chip packaging technology through partnerships with AMD Inc. and major foundries, marking its expansion in the artificial intelligence computing market.
The Taiwan-based manufacturer unveiled its 3D AI Foundry strategy, which focuses on multi-layer wafer stacking and high-capacitance interposer technology. Production is set to ramp up in the second half of 2025 at its Tongluo facility, where new equipment installation is underway.
Chairman Huang Chongren outlined four key business segments: logic foundry, memory foundry, 3D AI Foundry, and FAB IP. The company secured a notable contract with India’s Tata Microelectronics, expected to generate NT$20 billion (US$625 million) in staged payments over the next several years.
Power Semiconductor aims to differentiate itself in the competitive chip manufacturing landscape by focusing on high-performance, energy-efficient AI computing solutions. The company is already in technical discussions with several global AI technology firms, though specific details of these partnerships weren’t disclosed.
The move comes as semiconductor manufacturers worldwide race to develop advanced packaging solutions for AI applications, with established players like TSMC and Intel already commanding significant market share in this segment.
