Samsung and SK hynix are accelerating their development of next-generation HBM4 memory chips, responding to Nvidia’s revised timeline for its Rubin graphics processors. The US chip designer reportedly aims to launch Rubin in the third quarter of 2025, moving up its original 2026 schedule.
SK Group’s chairman indicated the company’s chip development is now outpacing Nvidia’s requirements, while Samsung targets to complete its production readiness approval by mid-2025. This represents a six-month advancement in both companies’ original timelines.
The expedited schedule comes as Samsung still grapples with qualifying its current HBM3E memory for Nvidia’s standards. Nvidia CEO Jensen Huang acknowledged Samsung’s efforts to develop a new design to meet requirements, though the Korean manufacturer faces pressure to deliver both current and future memory solutions simultaneously.
Industry sources suggest Samsung’s progress in developing 1c DRAM technology, essential for HBM4 production, showed promise after achieving functional chips in late 2024. However, the concurrent push for HBM4 development while still finalizing HBM3E qualification highlights the intense competition between Korean memory makers to secure deals with the dominant AI chip designer.