On May 30, MediaTek introduced its latest Dimensity 7300 series mobile chips, featuring the Dimensity 7300 and Dimensity 7300X, both built on TSMC’s highly efficient 4nm process. These chips promise exceptional energy efficiency and robust performance, catering to the demands of multitasking, imaging, gaming, and AI computing in modern devices.
The Dimensity 7300 series boasts an octa-core CPU configuration with four Arm Cortex-A78 cores operating at 2.5GHz and four Cortex-A55 cores. This configuration enables the Dimensity 7300 to achieve up to 25% power savings compared to its predecessor, the Dimensity 7050, while maintaining the same performance levels.
One of the standout features of the Dimensity 7300 is its 12-bit HDR-ISP image processor, the Imagiq 950, which supports up to a 200MP main camera. This allows users to capture images with exceptional color accuracy and detail. The chip also includes a new hardware engine for precise noise reduction (MCNR), hardware face detection (HWFD), and video HDR capabilities, ensuring clear images in diverse lighting conditions.
Dr. Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business, highlighted the significance of these advancements: “The MediaTek Dimensity 7300 chips will be important for integrating the latest AI enhancements and connectivity features so consumers can seamlessly stream and game. Furthermore, the Dimensity 7300X enables OEMs to develop innovative new form factors thanks to its dual display support.”
The Dimensity 7300 also features the AI processor APU 655, delivering performance twice that of the Dimensity 7050. This improvement translates to a 1.3 times enhancement in live focus photo performance and a 1.5 times boost in photo remastering capabilities. Additionally, the dynamic range for 4K HDR video recording has been increased by 50%, offering richer image details.
With these advancements, MediaTek’s Dimensity 7300 series sets a new benchmark for mobile chip performance and efficiency, paving the way for more powerful and versatile next-generation devices.
