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MediaTek Unveils Cutting-Edge ASIC Design Platform at OFC 2024

The innovative platform features co-packaged optics, enhancing data transmission efficiency and flexibility for AI and high-performance computing
m 2454.TW Blue Chip 150 Semicon 75 Tech 350 OM 60
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On the cusp of the Optical Fiber Communications Conference (OFC 2024), MediaTek has introduced a groundbreaking customized chip (ASIC) design platform, setting a new industry standard for high-speed data transmission. This platform amalgamates MediaTek’s high-speed SerDes electronic signal transmission with Ranovus’ Odin optical engine, offering unparalleled data interface solutions.

MediaTek’s new generation platform is engineered to support 8 sets of 800Gbps electronic and optical signal links, providing exceptional configurability and adaptability to meet diverse customer requirements. The integration of heterogeneous co-packaged optics (CPO) underscores a significant advancement, merging 112Gbps long-range SerDes with sophisticated optical modules. This synergy not only shrinks the required circuit board space but also slashes device costs, boosts bandwidth density, and cuts system power consumption by up to 50%.

The Odin optical engine from Ranovus is a core component of this solution, featuring versatile laser optical modules tailored for various deployment scenarios. MediaTek’s expertise in advanced 3nm process technology, combined with its proficiency in 2.5D and 3D packaging, ensures that this platform is well-suited for the latest demands in high-performance computing (HPC), artificial intelligence (AI), and machine learning (ML).

You Renjie, MediaTek’s Senior Deputy General Manager, emphasized the escalating requirements in data centers propelled by the generative AI boom. This surge necessitates enhancements in memory bandwidth, capacity, and notably, the density and speed of transmission interfaces. MediaTek’s latest offering is poised to cater to these growing needs, offering a sophisticated, adaptable solution for the most demanding data environments.

At OFC 2024, MediaTek, in partnership with Ranovus, will showcase this revolutionary CPO solution, demonstrating its commitment to propelling the fields of AI, ML, and HPC forward. This platform is not just a technological leap but also a testament to MediaTek’s integrated approach, spanning from design to production, ensuring clients receive comprehensive, state-of-the-art solutions tailored to their specific high-tech needs.

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