Apple is reportedly preparing to use Taiwan Semiconductor Manufacturing Co.’s (TSMC) 2nm process for its upcoming iPhone 17 Pro and 17 Pro Max models, a move that reflects the growing demand for TSMC’s cutting-edge chip technology. The iPhone 17 Air, a rumored ultra-thin model, may continue to use the current 3nm family process.
While neither Apple nor TSMC have officially commented on these reports, sources indicate that Apple’s shift to 2nm chips aligns with its ongoing efforts to enhance AI capabilities across its devices. TSMC has been aggressively expanding its 2nm production capacity, with its first 2nm fab in Baoshan expected to begin operations by 2025.
Demand for TSMC’s 2nm chips extends beyond Apple, with companies like Intel also vying for early access to the technology. The rapid development of AI applications has driven this surge, leading TSMC to expedite its expansion plans across multiple factories, including facilities in Zhuke, Kaohsiung, and potentially Nanke. The company aims to meet increasing market demand ahead of the expected mass production rollout in 2025.
TSMC’s aggressive push into 2nm fabrication underscores its dominant position in the semiconductor industry as it continues to serve major clients across sectors, including smartphones and AI.
