Tazmo Co., Ltd. manufactures and sells semiconductor manufacturing equipment in Japan, Taiwan, China, South Korea, Vietnam, rest of Asia, North America, and Europe. The company operates through three segments: Process Equipment Business, Mold/Resin Molding Business, and Surface Treatment Equipment Business. It provides semiconductor manufacturing equipment comprising bonder/debonders, cleaning systems, CMP slurry distribution systems, coater/developers, and phosphoric acid reclamation process equipment; clean transfer equipment, including atmospheric and vacuum robots, and pre aligners; nanoimprint fully automated mass production equipment; FPD manufacturing equipment, such as FDP/PLP coaters and manual coaters; precision molding dies and plastic moldings comprising mold and injection molding, emboss carrier tapes, and precision parts; and UV irradiation systems. The company offers LCD manufacturing equipment; UV laser equipment plating equipment, mold resin molding, and plating/circuit formation equipment for PCB. The company was incorporated in 1972 and is headquartered in Okayama, Japan.
Symbol
6266.TSE
Exchange
TSE
Isin
JP3468000009
Country
Japan
Sector
Technology
Industry
Electronic Components
CEO
Mr. Toshio Ikeda
Headquarter
Okayama
Web site
https://www.tazmo.co.jp