TSMC is poised to power Apple’s thinnest iPhone ever with its 2nm chip technology, as demand for advanced semiconductors continues to surge beyond the manufacturer’s capacity.
The Taiwanese chipmaker’s 2nm process, scheduled for mass production in 2025, has secured Apple as its first customer. The technology is expected to enable a remarkably slim 6mm iPhone model, codenamed iPhone 17 Slim or Air, planned for late 2025 release.
While Apple has claimed priority access to the 2nm production line, other major clients including Intel are queuing up through 2026. The overwhelming demand has prompted TSMC to consider expanding its Southern Taiwan Science Park facility.
The semiconductor giant’s existing 3nm production lines are already running at full capacity, primarily serving Apple’s iPhone 16 lineup. Industry sources indicate that most smartphone processors will transition to TSMC’s 3nm process by 2025, including Apple’s A19 Pro chip.
NVIDIA and AMD are also betting on TSMC’s advanced nodes for their upcoming AI accelerators, adding pressure to the tight capacity situation. The planned AI PC chip collaboration between MediaTek and NVIDIA will further strain TSMC’s production capabilities.
