Taiwan Semiconductor Manufacturing Co. unveiled its next-generation A14 process technology, designed to drive AI transformation forward with significant performance enhancements over its current N2 process. The A14 node, scheduled for production in 2028, will deliver up to 15% speed improvement at the same power or up to 30% power reduction at the same speed, alongside more than 20% increase in logic density.
TSMC continues maintaining its technological edge over rivals Intel and Samsung as competition intensifies in advanced semiconductor manufacturing. The company’s Chairman and CEO Dr. C.C. Wei emphasized the importance of these advancements, stating they form part of a “comprehensive suite of solutions” connecting physical and digital worlds for AI innovation.
The chipmaker also revealed plans for expanded Chip on Wafer on Substrate (CoWoS) technology to address growing AI demands, with plans to bring 9.5 reticle size CoWoS to volume production in 2027. This would enable integration of 12 high-bandwidth memory stacks in a single package. TSMC’s System-on-Wafer (SoW-X) technology, also scheduled for 2027 production, promises computing power 40 times greater than current solutions.
The announcement comes as TSMC reported strong financial results for Q1 2025, with net income increasing 60.3% year-over-year to NT$361.56 billion (US$11.1 billion). High-performance computing applications, including AI and 5G, drove 59% of TSMC’s quarterly revenue. Despite new tariff uncertainties under the Trump administration, the company maintains its forecast of close to mid-20% revenue growth for 2025, highlighting confidence in continued AI-driven demand.
