Taiwan Semiconductor Manufacturing Co. plans to hold its board meeting in the United States for the first time, signaling deeper commitment to its American expansion as the chipmaker’s Arizona facility begins mass production.
The world’s largest contract chipmaker started volume production at its Fab 21 Phase 1 facility in Arizona this quarter, utilizing 4-nanometer technology. The plant’s monthly capacity is expected to reach 30,000 wafers by mid-year. The company plans to construct two additional phases, with Phase 2 and 3 scheduled for completion in 2025 and 2027, respectively, incorporating 2-nanometer technology with advanced Nanosheet transistor architecture.
Industry analysts suggest TSMC may add advanced packaging capabilities in Texas, completing its US manufacturing ecosystem. The move comes as the company navigates potential semiconductor tariffs under the Trump administration while maintaining its technological edge in advanced chip production.
TSMC Chairman Mark Liu expects 25% growth in 2025, driven by robust artificial intelligence server demand. The company projects AI-related revenue to comprise 25% of total sales this year, with a compound annual growth rate of 44-46% over the next five years. While facing seasonal weakness in smartphone chips, particularly from Apple, strong high-performance computing demand helps offset the impact.
