Taiwan Semiconductor Manufacturing Co. plans to begin construction on a massive 1.4-nanometer facility in October, with the Central Taiwan Science Park Bureau confirming preparations for the NT$1.2 trillion to NT$1.5 trillion ($37 billion to $46 billion) project.
The timing appears strategic as competitors retreat from advanced manufacturing. Intel’s new CEO Lip-Bu Tan suggested pausing development of the company’s 1.4nm process during recent earnings calls, while Samsung has reportedly delayed its 1.4nm mass production timeline from 2027 to potentially 2029, focusing instead on yield improvements for current nodes.
TSMC’s Central Taiwan facility will house four fabrication buildings designated as Fab 25, according to industry sources. The first building aims to complete risk production by late 2027, with mass production targeted for the second half of 2028. Initial monthly capacity is planned at 50,000 wafers.
The investment underscores the astronomical costs of cutting-edge semiconductor manufacturing. Each 1.4nm extreme ultraviolet lithography machine carries a price tag of $400 million to $600 million, while individual fabrication facilities require investments exceeding NT$300 billion ($9.2 billion) each.
TSMC had previously abandoned plans for a 1.4nm facility in the Longtan section of Hsinchu Science Park, but remains committed to maintaining Taiwan as its primary manufacturing base for the most advanced processes.
