Taiwan’s semiconductor industry activated emergency protocols late on December 27 after a magnitude 7.0 earthquake struck offshore Yilan, the strongest tremor to hit the island since April 2024.
Taiwan Semiconductor Manufacturing Co. evacuated workers from select Hsinchu Science Park facilities after seismic activity reached predetermined thresholds. The company reported all safety systems functioned normally, with supply chain analysts expecting near-full equipment recovery by December 29. TSMC’s Hsinchu operations encompass critical 7nm and 5nm production lines, while its nearby Baoshan Fab 20 handles 2nm mass production.
Memory chipmakers faced a sharper divide. Industry sources indicated northern facilities suffered damage to quartz furnace tubes and in-process wafers, with some sensitive equipment requiring shutdown for calibration. Central and southern plants reported minimal disruption.
Vanguard International Semiconductor said personnel were safe and equipment recalibration was underway. United Microelectronics noted its 12-inch fab operations in Tainan’s science park experienced only minor tremors, while monitoring continued at Hsinchu 8-inch facilities. Powerchip Semiconductor reported damage lighter than April’s magnitude 7.4 event and is pursuing insurance claims.
Taiwan’s advanced fabs have invested heavily in seismic countermeasures since the devastating 1999 earthquake. During April 2024’s quake, TSMC restored 70% of equipment within 10 hours and limited losses to approximately NT$3 billion ($95 million). Most domestic chipmakers carry earthquake insurance, suggesting any financial impact will prove temporary.
