Solus Advanced Materials has secured final mass production approval to supply high-end copper foil for Nvidia’s upcoming AI accelerators, positioning itself as a critical player in the advanced materials sector. This milestone marks Solus as the first domestic company to provide Nvidia with copper foil for AI applications, driving its shares up by over 25%.
The approved copper foil features high-value low-profile (HVLP) technology, which significantly reduces surface roughness to less than 0.6 micrometers. This technological advancement minimizes signal loss in electronic devices, making it ideal for AI accelerators, 5G telecommunications equipment, and high-efficiency network substrates. The HVLP copper foil will be supplied to Doosan Electronics BG, a leading manufacturer of copper-clad laminates (CCL), and is expected to be a key component in Nvidia’s next-generation AI accelerators set to launch this year.
In addition to its partnership with Nvidia, Solus Advanced Materials has also received product approval from Intel for its next-generation AI accelerator copper foil and is currently undergoing performance testing with AMD. These developments underscore Solus’s expanding footprint in the AI and semiconductor industries.
The HVLP copper foil from Solus Advanced Materials represents a significant advancement in reducing electronic signal loss, which is crucial for the efficiency of AI accelerators and other high-speed data transmission devices. With these strategic approvals, Solus is well-positioned to capitalize on the growing demand for advanced materials in AI and telecommunications.
As Solus Advanced Materials continues to innovate and secure high-profile partnerships, it sets a precedent for other domestic companies aiming to break into the competitive field of AI and semiconductor materials supply.
