SK Hynix announced plans to develop tailored memory products as performance gaps between processors and memory chips threaten to constrain artificial intelligence systems, according to CEO Kwak Noh-jung speaking at an industry event in Seoul on Sunday.
The South Korean chipmaker is preparing custom high-bandwidth memory that integrates certain GPU and ASIC functions into HBM base dies, alongside specialized DRAM and NAND solutions. Kwak said the company aims to become a “full-stack AI memory creator” rather than just a supplier, addressing what he described as the “Memory Wall” bottleneck where memory performance lags processor capabilities.
The strategy shift comes as SK Hynix reported record third-quarter revenue of ₩24.45 trillion ($17.13 billion), with operating profit reaching ₩11.38 trillion ($7.98 billion). The company captured 35% of the global DRAM market in the third quarter, marking its third consecutive quarter atop the sector, according to Counterpoint Research.
The company is developing three categories of AI DRAM products focused on optimization, breakthrough capacity, and expanded applications, alongside collaborations with SanDisk on hybrid HBM-NAND products.
Samsung and Micron have been working to close SK Hynix’s lead in the HBM market, with both rivals recently making supplier inroads with Nvidia.
