SK Hynix is joining forces with Amkor Technologies, the world’s second-largest OSAT (outsourced semiconductor assembly and test company), to penetrate the silicon interposer market, a critical component in 2.5D packaging for AI accelerators like NVIDIA’s H100.
According to industry sources, SK Hynix has initiated negotiations with Amkor to supply interposer samples, aiming to become a key interposer supplier for NVIDIA. SK Hynix plans to deliver its HBM and interposers to Amkor, which will then integrate them with GPUs from clients like NVIDIA to assemble AI accelerators. An SK Hynix representative stated, “We are in the early stages and conducting various reviews to meet customer requirements.”
AI accelerators rely on 2.5D packaging, which uses a silicon interposer to precisely connect semiconductor dies, such as GPUs and HBM, enhancing circuit precision compared to traditional PCB-based 2D packaging. This method is essential for producing advanced AI accelerators, making silicon interposers a pivotal technology.
While several OSAT companies can handle GPU and HBM integration, the production of silicon interposers remains a high-barrier field, dominated by TSMC, Samsung Electronics, Intel, and UMC. TSMC and Samsung Electronics leverage their interposer technology through branded 2.5D packaging solutions like CoWoS and iCube, respectively.
SK Hynix’s venture into the silicon interposer market is part of its strategy to surpass Samsung Electronics in the HBM sector. Currently, SK Hynix supplies NVIDIA with HBM3 and HBM3E, while Samsung is yet to do so but provides NVIDIA with silicon interposers and iCubes. As Samsung moves towards a turnkey strategy with NVIDIA, SK Hynix aims to solidify its alliance with NVIDIA by offering bundled HBM and silicon interposers, potentially alleviating supply bottlenecks for NVIDIA’s AI accelerators.
By entering the interposer market, SK Hynix not only strengthens its position in advanced packaging technology but also addresses the supply chain challenges that hinder NVIDIA’s production capacity. This strategic move could enable NVIDIA to increase its AI accelerator output by partnering with a broader range of OSATs.
The interposer market is poised for significant growth, projected to expand from $256.3 million in 2021 to $1.72 billion by 2030, according to Business Research Insight. As the demand for advanced packaging technology surges, SK Hynix’s proactive steps in securing interposer technology position it advantageously in the competitive semiconductor landscape.
