The semiconductor industry’s construction spree shows no signs of slowing, with 18 new manufacturing facilities planned to break ground in 2025, according to SEMI’s latest quarterly forecast.
The Americas and Japan are leading the expansion with four projects each, while China and Europe share third place with three facilities each. The buildout includes fifteen 300mm and three 200mm fabs, most set to start production by 2027.
Global chip capacity is expected to climb 6.6% to 33.6 million wafers monthly in 2025, driven by demand for advanced computing and artificial intelligence applications. The foundry segment, dominated by contract manufacturers, is projected to boost output by 10.9% to 12.6 million wafers monthly.
Despite industry-wide mature node slowdown, manufacturers are racing to add cutting-edge capacity. Advanced nodes of 7 nanometers and below are forecast to surge 16% annually, reaching 2.2 million wafers monthly. This push comes as chip companies scramble to meet computational requirements for large language models.
SEMI CEO Ajit Manocha cited generative AI and high-performance computing as key drivers for both leading-edge and mainstream technology investments, though the report indicates mature nodes face conservative growth amid slow market recovery.
