Samsung Electronics Co. captured more than 60% of Google’s high-bandwidth memory orders this year through chipmaker Broadcom Inc., marking a notable turnaround for a company that spent much of 2024 struggling to meet customer specifications.
The reversal came after Samsung redesigned the DRAM architecture in its HBM3E products to address persistent thermal issues that had plagued earlier versions, according to Korea Economic Daily. SK Hynix Inc. held the larger share during the first half, but Samsung’s aggressive second-half push shifted annual totals in its favor.
Export data underscores the shift. Shipments of advanced memory from Samsung’s Asan packaging facility reached $8.2 billion (₩12 trillion) between July and October, a 19.2% increase from the same period last year, Korea Economic Daily reported, citing alternative data platform Aicel.
Samsung is now awaiting HBM4 qualification results from major customers including Nvidia Corp., with executives expecting preliminary feedback as soon as December. The company showcased its sixth-generation memory at a recent semiconductor conference, demonstrating 36GB capacity and 3.3TB per second bandwidth.
SK Hynix, which remains the dominant supplier to Nvidia, dismissed recent speculation about design problems with its own HBM4. Company officials stated that pricing and volumes for 2026 are finalized, with meaningful production expected from late Q2. Non-Nvidia customers, including Google, account for roughly 30% of SK Hynix’s HBM revenue, a ratio the company indicated will remain largely unchanged next year.
