On Wednesday, Resonac, previously known as Showa Denko, revealed its intention to establish a research and development center in Silicon Valley focused on advanced semiconductor packaging and materials. The packaging phase of chip production is gaining prominence in driving technological advancements, particularly as the U.S. initiates a $3 billion program this week to enhance its packaging capabilities.
Resonac, a prominent player in chip materials manufacturing, specializes in producing films crucial for packaging processes. The new research and development center, slated to commence operations in 2025, underscores the company’s commitment to innovation in semiconductor packaging technologies.
As Japan’s chip sector seeks strengthened collaborations with the U.S., the move by Resonac aligns with a broader trend. Rapidus, a foundry venture, is also planning to establish a sales office in the U.S. by the end of the current financial year. This expansion reflects a strategic effort to deepen ties and enhance engagement with the U.S. semiconductor market.
The establishment of Resonac’s R&D center in Silicon Valley signifies a pivotal step in fostering global partnerships and staying at the forefront of semiconductor packaging advancements, aligning with the evolving landscape of the chip industry.
