MediaTek launched its new Dimensity 9400e flagship mobile platform and T930 5G Fixed Wireless Access (FWA) chipset, expanding its portfolio in both smartphone and broadband markets. The company’s latest offerings leverage Taiwan Semiconductor’s third-generation 4nm process to deliver enhanced AI capabilities while focusing on power efficiency.
The Dimensity 9400e features the “All Big Core” CPU architecture pioneered by MediaTek, with eight high-performance cores arranged in a 4+4 configuration. Supporting major language models like DeepSeek-R1-Distill and Google’s Gemini Nano, the chipset aims to compete directly with Qualcomm’s Snapdragon 8s Gen 4 in the premium segment.
Chinese manufacturers OnePlus and Realme will be first to market with the new chipset later this month, with devices priced competitively under NT$10,000 (US$312). MediaTek’s Wireless Communications Business GM Li Yanqi emphasized high performance, intelligence, efficiency and low power consumption as core strengths of the platform.
Meanwhile, the T930 FWA chipset targets the growing market for fixed wireless broadband solutions, delivering up to 10Gbps download speeds via Sub-6GHz 5G. This third-generation platform includes advanced capabilities like 6CC-CA downlink and 5-layer 3Tx uplink, potentially transforming home connectivity options while supporting AI edge processing.
According to supply chain sources, MediaTek will launch additional Dimensity 9400+ devices in Q2, with a next-generation flagship SoC planned for the second half of 2025, as the company continues expanding market share through its AI-focused product strategy.
