MediaTek, a leading IC design firm, showcased its prowess at an overseas summit, where Vice Chairman and CEO Tsai Lixing shared insights into the company’s strategies and products with American industry analysts and media. Tsai highlighted the capabilities of the next-generation flagship mobile phone single-chip, Dimensity 9300, emphasizing its robust computing prowess and support for various generative AI functions. The company anticipates that the revenue generated by this new product line will surpass $1 billion in 2023.
Addressing the sweeping influence of AI, Tsai remarked on the accelerating AI wave, predicting an expansive impact on technology’s digital transformation. MediaTek, leveraging its robust processor development capabilities and cross-computing platform portfolio, is strategically positioned to collaborate closely with industry partners, utilizing advanced processes and packaging technologies to capture market opportunities across diverse demands and application scenarios. In cloud AI, MediaTek boasts core technologies such as SerDes and Deep Learning Accelerator (DLA), reinforcing its role as an AI enabler and delivering cross-platform solutions spanning edge, cloud, and hybrid AI.
Tsai emphasized MediaTek’s unique standing as one of the few edge AI companies capable of supporting a wide array of major devices, shipping approximately 2 billion terminal devices annually. Strengthening partnerships and expanding collaborations, MediaTek aims to provide customers with comprehensive solutions through its extensive IP and technology portfolio.
Highlighting recent collaborations, Tsai discussed MediaTek’s partnership with Huida on smart cockpit solutions, aimed at designing a new generation of smart connected cars to enhance the Dimensity Auto automotive platform. Additionally, Jean Boufarhat, Vice President of Meta Reality Labs, joined the summit to announce a collaboration with MediaTek on the development of the next generation of AR glasses.
