Hon Hai Group is advancing its technological prowess by investing in cutting-edge panel-level fan-out packaging (FOPLP) in both Taiwan and Japan. Following Innolux’s strategic layout in Taiwan, Hon Hai’s reinvested company Sharp has announced its foray into FOPLP, with production capabilities set to commence in 2026.
With robust AI-driven tools and advanced packaging technologies, Hon Hai is well-positioned to secure future orders. Sharp’s transformation, underpinned by significant investments, promises to benefit not only Hon Hai but also key stakeholders like Hongzhun, which holds a 10.5% stake in Sharp, and Guangyu, a long-time partner in various electronic components. This strategic alignment is anticipated to yield new orders, creating a multiplier effect across the supply chain.
Sharp’s collaboration with Japanese electronic component manufacturer Aoi Electronics marks a significant step in this direction. Aoi will utilize Sharp’s existing facilities to establish a semiconductor back-end process production line at Sharp’s Mie Factory, targeting a full production capacity of 20,000 pieces per month by 2026.
Innolux, despite Hon Hai’s withdrawal from its board, remains a major shareholder and is actively transforming its operations to include FOPLP. With an investment of NT$2 billion in FOPLP, Innolux aims to commence mass production in 2024, focusing on both communication products and automotive fast-charging chips.
As Hon Hai, Sharp, and Innolux enhance their advanced packaging capabilities, the group’s collective efforts are set to significantly impact the semiconductor industry’s landscape, driving innovation and growth in the region.
