ASE Technology Holding, the world’s largest outsourced semiconductor assembly and test provider, announced a batch of capital commitments exceeding NT$5 billion (US$160 million) through its subsidiaries on Thursday, signaling confidence in long-term packaging and testing demand.
Siliconware Precision Industries, ASE’s packaging subsidiary better known as SPIL, disclosed multiple facility construction contracts totaling NT$4.34 billion (US$139 million). The largest deal, worth NT$1.878 billion (US$60 million), was signed with Liming Construction and runs from November 2025 through December 2027. Additional agreements with Shenghui Engineering Technology, Taijing Engineering, and Shengyi Construction range from NT$665 million to NT$964 million (US$21 million to US$31 million) each.
Separately, ASE Semiconductor Manufacturing committed NT$1.024 billion (US$33 million) to equipment purchases from Advanced Pacific’s Taiwan branch, covering orders placed between March and December 2025.
The staggered timelines suggest ASE is taking a phased approach to capacity expansion rather than a single large-scale buildout. The investments come as the company navigates U.S. tariff uncertainties while also participating in Nvidia’s Arizona AI infrastructure project. ASE raised its 2025 capital expenditure target to over US$6 billion, up from an initial US$2.5 billion forecast, citing robust advanced packaging demand driven by artificial intelligence applications.
