The upcoming fourth quarter is set to witness an intense battle in the 5G mobile phone chip market as MediaTek and Qualcomm prepare to launch their latest flagship processors. MediaTek’s “Dimensity 9400” and Qualcomm’s “Snapdragon 8 Gen 4” are both poised to compete head-to-head, leveraging TSMC’s cutting-edge 3nm process technology.
Both manufacturers have recently commenced wafer production at TSMC, with MediaTek striving to ensure a sufficient supply for its Dimensity 9400. The 3nm process represents the pinnacle of current semiconductor technology, with TSMC’s capacity already in high demand from major players like NVIDIA, AMD, and Apple. TSMC’s advanced process business is booming, with customers queuing for 3nm capacity up until 2026.
MediaTek’s CEO, Tsai Li-hsing, announced earlier this year that the Dimensity 9400 would debut in the fourth quarter, promising significant performance improvements over its predecessor, the Dimensity 9300. This new chip is expected to solidify MediaTek’s position in the market, building on the success of its current flagship chips produced with TSMC’s 4nm technology.
Qualcomm, while not yet disclosing specific details or a launch date for the Snapdragon 8 Gen 4, is anticipated to also utilize TSMC’s 3nm process. Reports suggest the new Snapdragon chip, produced with TSMC’s N3E process, could be priced 25-30% higher than its predecessor, with unit prices ranging from $220 to $240. Qualcomm’s chips are known for their strong market presence, often adopted by numerous top-tier brands. The Snapdragon 8 Gen 4 is expected to follow this trend, attracting a significant customer base upon its release.
As both companies gear up for their respective launches, the tech world is watching closely to see which flagship chip will dominate the market and how TSMC’s production capabilities will meet the soaring demand. This new wave of 5G chip competition underscores the rapid advancements in semiconductor technology and the ongoing race for supremacy in the mobile processor arena.
