E&R Engineering Corporation provides automation machines for semiconductor, light emitting diode (LED), passive component, material, and medical industries in Taiwan, Hong Kong, Mainland China, Southeast Asia, the United States, Europe, and internationally. The company offers laser solutions, including wafer and package marking; and micromaching, such as laser drilling, cutting, scribing, and grooving solution. It also provides plasma technology products comprising wafer and panel forms, and L/F substrates; flexible printed circuit equipment that consists of RTR, STS, lamination, punch, plating, and open cover machines; embossed carrier tape, cover tape, and E&R tape and reel products; and workshop and laser process development services. E&R Engineering Corporation was incorporated in 1994 and is headquartered in Kaohsiung, Taiwan.