All data are based on the daily closing price as of April 1, 2025
c

Chipbond Technology

6147.TWO
2.00 USD
0.04
+2.04%

Overview

Last close
2.00 usd
Market cap
1.49B usd
52 week high
2.52 usd
52 week low
1.87 usd
Target price
1.86 usd

Valuation

P/E
12.1129
Forward P/E
11.919
Price/Sales
2.4349
Price/Book Value
1.027
Enterprise Value
1.21B usd
EV/Revenue
1.9747
EV/EBITDA
4.9213

Key financials

Revenue TTM
612.58M usd
Gross Profit TTM
137.61M usd
EBITDA TTM
176.70M usd
Earnings per Share
0.17 usd
Dividend
N/A usd
Total assets
1.59B usd
Net debt
N/A usd

About

Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and Mainland China. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; test services; and die processing services, such as wafer grinding/thinning,dicing, and tape-and-reel processes, as well as chip-on-film, chip on glass, chip-on-plastic, packaging attachment, and wafer level chip scale packaging services. It also provides compound semiconductors including SiGe, GaAs, GaN, SiC, and other wafers; flexible tape-and-reel circuit substrate; and chip tray. In addition, it develops, manufactures, packages, tests, sells, and after-sale services of integrated circuit and special materials for semiconductor; invests in, develops, manufactures, and sells electronic components; and manufactures and sale of elements. Chipbond Technology Corporation was incorporated in 1997 and is based in Hsinchu City, Taiwan.
  • Symbol
    6147.TWO
  • Exchange
    TWO
  • Isin
    TW0006147002
  • Country
    Taiwan
  • Sector
    Technology
  • Industry
    Semiconductor Equipment & Materials
  • CEO
    Mr. Fei-Jain Wu
  • Headquarter
    Hsinchu City
  • Web site
    https://www.chipbond.com.tw
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