All data are based on the daily closing price as of December 24, 2024
x
Xintec
3374.TWO
6.21 USD
-0.14
-2.20%
Overview
Last close
6.21 usd
Market cap
1.68B usd
52 week high
8.75 usd
52 week low
3.30 usd
Target price
4.51 usd
Valuation
P/E
33.6093
Forward P/E
N/A
Price/Sales
8.1608
Price/Book Value
6.5294
Enterprise Value
1.63B usd
EV/Revenue
7.5785
EV/EBITDA
19.9889
Key financials
Revenue TTM
206.43M usd
Gross Profit TTM
87.68M usd
EBITDA TTM
75.59M usd
Earnings per Share
0.18 usd
Dividend
N/A usd
Total assets
363.18M usd
Net debt
N/A usd
About
Xintec Inc. operates as a wafer level chip scale packaging company in Asia, the United States, and Europe. The company offers wafer level chip scale packaging for image and environmental sensors; wafer level post passivation interconnection for fingerprint and actuator sensors, micro-electromechanical components, power, analog, and RF components; and wafer testing services. It also provides optical sensor chip scale packaging services comprising side-wall interconnect and through silicon via RDL interconnect products, various glass thickness and filters, and glass bonding to wafer with or without cavity; FSI/BSI/stack wafer reconstruction for mobile, automotive, and consumer applications; and wafer reconstruction with a glass lid for automotive applications. In addition, the company provides micro-electromechanical systems sensor packaging services, such as wafer thinning and bonded wafer partial dicing to reveal bonding pad; CSP, using via last TSV to connect pad on wafer surface toward backside; and dry etching silicon to form large cavities to derive product performance needs; as well as 3D I/O redistribution, power ground enhancement, and dual side connection services. Its products are used in tablets, notebooks, computers, and medical applications. Xintec Inc. was incorporated in 1998 and is headquartered in Taoyuan City, Taiwan.