Winstek Semiconductor

Winstek Semiconductor Co., Ltd., together with its subsidiaries, engages in the testing of integrated circuits, chip bumping, and wafer packaging services in Taiwan, United State, Mainland China, Singapore, and internationally. It operates through Test Business and Packaging Business segment. The company offers test services, such as wafer sort, final test, post-test, engineering support, and test platforms services; and bump services, including copper pillar bump, wafer level chip scale package, lead free bump, plating bump/ball drop/RDL, 6S protection, heterogeneous bump, and backside metallization services. It also provides backend services comprising die processing, wafer thinning, singulation, and flip chip services; and verification analysis services, such as failure analysis and reliability testing services, as well as electrical and thermal simulation services. The company was formerly known as Stats ChipPac Taiwan Semiconductor Corp. and changed its name to Winstek Semiconductor Co., Ltd. in June 2015. The company was founded in 2000 and is headquartered in Hsinchu City, Taiwan. Winstek Semiconductor Co., Ltd. is a subsidiary of SIGWIN Corporation.