Winstek Semiconductor

Winstek Semiconductor Co., Ltd., together with its subsidiaries, engages in the testing of integrated circuits and chip bumping and wafer packaging services in Taiwan. It operates in three segments: Test Business, Packaging Business, and Factory Development. The company offers test services, such as wafer sort, final and post-test, engineering support, and test platforms services; and bump services, including copper pillar bump, wafer level chip scale package, lead free bump, plating bump/ball drop/RDL, 6S protection, heterogeneous bump, and backside metallization services. It also provides backend services comprising die processing, wafer thinning, singulation, and flip chip services; and verification analysis services, such as failure analysis and reliability testing services. The company was formerly known as Stats ChipPac Taiwan Semiconductor Corp. and changed its name to Winstek Semiconductor Co., Ltd. in June 2015. The company was founded in 2000 and is headquartered in Hsinchu City, Taiwan. Winstek Semiconductor Co., Ltd. is a subsidiary of SIGWIN Corporation.