Winstek Semiconductor

Winstek Semiconductor Co., Ltd., together with its subsidiaries, engages in the research, development, and testing of integrated circuits in Taiwan. It offers wafer sort, final and post-test, engineering support, and test platforms services; copper pillar bump, wafer level chip scale package, lead free bump, plating bump/ball drop/RDL, 6S protection, and heterogeneous bump, backside metallization services; die processing, wafer thinning, singulation, and flip chip services; and failure analysis and reliability testing services. The company was formerly known as Stats ChipPac Taiwan Semiconductor Corp. and changed its name to Winstek Semiconductor Co., Ltd. in June 2015. The company was founded in 2000 and is headquartered in Hsinchu City, Taiwan. Winstek Semiconductor Co., Ltd. is a subsidiary of Ge-Shing Corporation.