All data are based on the daily closing price as of March 6, 2026
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Winbond Electronics

2344.TW
3.35 USD
-0.18
-5.10%

Overview

Last close
3.35 usd
Market cap
15.09B usd
52 week high
4.15 usd
52 week low
0.40 usd
Target price
5.18 usd

Valuation

P/E
121.0227
Forward P/E
N/A
Price/Sales
5.3604
Price/Book Value
4.3359
Enterprise Value
15.53B usd
EV/Revenue
5.5159
EV/EBITDA
26.3996

Key financials

Revenue TTM
2.82B usd
Gross Profit TTM
982.25M usd
EBITDA TTM
554.92M usd
Earnings per Share
0.03 usd
Dividend
N/A usd
Total assets
6.12B usd
Net debt
1.23B usd

About

Winbond Electronics Corporation engages in the research, development, production and sales of integrated circuits, various semiconductor components and other system products. The company offers customized memory solutions, including CUBE(3DCaaS), pseudo static random access memory, DDR/SDR, LPDDR/LPSDR, Known Good Die wafer products; electrical simulation, wafer-level speed testing, and other services; redistribution layers; and failure analysis services, as well as low power SDR, DDR, DDR2, DDR3, and DDR4/4X SDRAM products. It also provides specialty DRAM products, such as SDRAM, DDR SDRAM, DDR2 SDRAM, DDR3 SDRAM, and DDR4 SDRAM products; code storage flash memory products comprising serial NOR, 1.2V serial NOR, octal NOR, QspiNAND, OctalNAND, SLC NAND, NAND based MCP, SpiStack, and authentication flash products; TrustME secure flash memory, such as secure flash memory, and secure memory elements; and logic IC products. In addition, the company is involved in the research, development, design, sale, and after-sales service of semiconductors and 6-inch wafer fab production, testing, and foundry services; E-commerce and investment business; semiconductor component design and marketing services; smart factory solutions; semiconductor-related hardware and software system integration design; design, research, testing, sales, and service of integrated circuits and auxiliary equipment; develops automotive and industrial control software and services; customer service and technical support; computer software services; computers and peripherals, and software wholesale; repair, testing, and related technical consulting services; and rental of semiconductor-related equipment. It markets its products through distributors and online. The company's products are used in computer, communication, consumer, automotive, and industrial electronics. Winbond Electronics Corporation was incorporated in 1987 and is headquartered in Taichung, Taiwan.
  • Symbol
    2344.TW
  • Exchange
    TW
  • Isin
    TW0002344009
  • Country
    Taiwan
  • Sector
    Technology
  • Industry
    Semiconductors
  • CEO
    Mr. Yu-Cheng Chiao
  • Headquarter
    Taichung
  • Web site
    https://www.winbond.com
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